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Job Overview
The Digital Data Networks business unit of TE Connectivity has an opportunity for a Senior Manager of Product Management for the Internal Cable and Connector product team, based in the US.
The Senior Manager of Product Management needs to drive cross-functional teams, including Sales/FAE & Marketing, System Architecture, Engineering, and Operations, to establish the ICC product lead position on N+1 and N+2 high-speed connectivity solutions, enabling the growth of AI/cloud infrastructure. The Senior Manager and their team own an end-to-end product lifecycle to achieve 5-year aspirational business goals.
The ideal candidate is expected to have Regular travel to the San Francisco Bay Area to visit high-profile customers.
What you will be doing:
- Conduct VOC to understand market desire to define ICC N+1 & N+2 product portfolio, focusing on AI/ML workloads, hyperscale data centers, and accelerated computing
- Conduct competitive displacement analysis to create ICC product strategy
- Manage and develop the ICC connector PM team to execute on the product strategy
- Drive and work with the system architecture team to create an eco-system around ICC N+1 & N+2 new products, driving industry standards wins, including but not restricted to PCI-Sig, OCP, SNIA, etc. (Forge alliances with semiconductor partners like NVIDIA, Intel, AMD to co-define next-gen interconnect architectures)
Develop relationships with ICC-focused customers to penetrate mainstream platforms/programs, thereby fueling the pipeline across the entire ICC product portfolio, including connectors and cables. - Drive share growth to hit ICC's 5-year aspirational financial targets.
What your background should look like:
Technical Excellence
- 8+ years of product management experience in AI/ML-driven/server hardware products, with a proven track record launching standards-driven products through PCI-Sig/OCP/SNIA
Commercial Leadership
- Experience managing global technical sales/FAE engagements to provide complex solutions
- Portfolio growth of ≥15% CAGR via platform design-wins at hyperscalers/OEMs
- Fluency in cost modeling (cable vs. substrate materials) and value-based pricing
Execution Rigor
- Demonstrated ability to align R&D/ R&D/Operations on accelerated NPI timelines
- Expertise in crisis mitigation (supply chain/capacity bottlenecks, qualification failures)
Preferred Qualifications
- Master’s degree in electrical or mechanical engineering
- Existing relationships with cloud technical architects or standards body working groups
- Experience with AI infrastructure deployments (GPU clusters, NVLink architectures).
Competencies
COMPENSATION
- Competitive base salary commensurate with experience: $161,500 - $242,200 (subject to change dependent on physical location)
- Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
- Total Compensation = Base Salary + Incentive(s) + Benefits
BENEFITS
- A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.
EOE, Including Disability/Vets
IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD
TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information and to report the incident to your local authorities.